Cov Khoom Siv Ruaj Ntseg Rau EV Roj Teeb Thermal Management Systems

Hauv qhov chaw ua khoom siv semiconductor uas muaj kev pheej hmoo siab, qhov kev ua haujlwm ntawm cov khoom sib khi tsis yog tsuas yog qhov teeb meem ntawm cov khoom siv xwb - nws yog qhov tseem ceeb ntawm kev txiav txim siab ntawm cov txiaj ntsig thiab kev ruaj khov ntawm cov txheej txheem. Hauv cov chaw ntxuav plasma thiab cov chaw ntxuav lub rooj ntev ntub dej, cov foob elastomeric ntsib kev sib xyaw ua ke ntawm cov tshuaj lom neeg reactive, cov plasmas muaj zog heev, thiab kev hloov pauv kub heev. Phau ntawv qhia no muab cov txheej txheem ua tiav rau kev xaiv cov tshuaj perfluoroelastomer (FFKM) sealing uas xa cov pa tawm xoom thiab cov pa tawm tsawg heev nyob rau hauv cov xwm txheej no.

1. Ib puag ncig ntawm Semiconductor Etching: Ib qho Trifecta ntawm Extremes

Cov txheej txheem etching, txawm tias qhuav (plasma) lossis ntub (tshuaj lom neeg), nthuav tawm cov teeb meem tshwj xeeb uas thawb cov ntaub ntawv ib txwm muaj dhau lawv cov kev txwv.

Cov Tshuaj Lom Zem Uas Ua Rau Mob: Cov tshuaj xws li hydrofluoric acid (HF), nitric acid, cov pa roj chlorine (Cl₂, BCl₃), thiab cov plasmas uas ua rau mob fluorine (CF₄, SF₆) tawm tsam cov saw polymer. Cov fluoroelastomers txheem (FKM) tuaj yeem raug kev txom nyem los ntawm kev o, tawg, lossis kev puas tsuaj sai sai hauv cov chaw no.

Kev Siv Plasma Muaj Zog Siab: Hauv cov cuab yeej etch qhuav, cov foob pob raug foob los ntawm cov hom ionized thiab UV hluav taws xob. Qhov no ua rau qhov chaw embrittlement, micro-cracking, thiab kev tsim cov khoom me me, uas cuam tshuam ncaj qha rau wafer defectivity.

Cov Kev Cai Nqus Tsev thiab Kev Huv Si: Cov txheej txheem niaj hnub no ua haujlwm ntawm qib nqus tsev siab (≤10⁻⁶ mbar). Txhua qhov pa tawm ntawm cov foob - kev tso tawm ntawm cov pa roj uas nqus tau lossis cov khoom seem - tuaj yeem ua rau lub chamber huab cua qias neeg, ua rau lub plasma impedance tsis ruaj khov, thiab ua rau muaj cov pa roj carbon dioxide.

2. Vim li cas FFKM yog qhov kev xaiv uas tsis zam tau rau kev txiav

Cov perfluoroelastomers sawv cev rau qhov zoo tshaj plaws ntawm kev ua haujlwm sealing rau cov ntawv thov no. Tsis zoo li FKM, uas khaws qee cov hydrogen hauv nws lub hauv paus, FFKM muaj cov qauv molecular uas muaj fluorinated tag nrho. Qhov sib txawv tseem ceeb no muab kev sib xyaw ua ke ze li ntawm thoob plaws ntiaj teb, zoo ib yam li PTFE, tab sis nrog qhov elasticity tseem ceeb uas xav tau rau kev sealing txhim khu kev qha.

Cov khoom siv lub peev xwm tiv taus qhov kub thiab txias tas mus li txog li 300–325 ° C thiab kev mus ncig luv luv dua ua rau nws tsim nyog rau cov cuab yeej etch, uas feem ntau dhau los ua qhov kev ua kom sov sai sai kom tshem tawm cov kuab paug.

3. Ua tiav xoom xau hauv cov kua qaub thiab cov ntshav muaj zog

Qhov xau hauv cov cuab yeej semiconductor tsis yog ib txwm pom dej ntws; nws tuaj yeem tshwm sim ua qhov txheej txheem hloov pauv lossis kev sib kis kab mob. FFKM daws qhov no los ntawm cov khoom siv thiab kev tsim qauv.

Kev Tsis Muaj Tshuaj Lom Zem: Cov pa roj carbon-fluorine hauv FFKM yog cov muaj zog tshaj plaws hauv cov organic chemistry. Qhov kev ruaj khov no tiv thaiv cov khoom siv los ntawm kev cuam tshuam nrog cov kua qaub thiab cov oxidizers uas muaj zog, tswj tau qhov geometry ntawm lub foob thiab lub zog nias rau ntau txhiab teev.

Kev Tiv Thaiv Plasma: Cov qib FFKM ua tau zoo heev tau tsim tshwj xeeb los tiv thaiv kev yaig hauv qab cov plasmas oxygen thiab fluorine. Tus yam ntxwv "tsis lo" no txo ​​qhov kev tsim cov khoom siv hluav taws xob ntawm phab ntsa chav thiab tiv thaiv lub foob kom tsis txhob ua rau cov txheej txheem poob.

Kev Ruaj Ntseg Thermal: Cov txheej txheem etching feem ntau cuam tshuam nrog kev hloov pauv thermal sai. FFKM tswj hwm qhov teeb tsa compression qis (feem ntau <20–30% tom qab raug tshav kub ntev), xyuas kom meej tias lub foob txuas ntxiv siv zog txaus rau ntawm lub qog txawm tias tom qab rov ua dua qhov kub thiab txias, yog li tiv thaiv kev xau ntawm qhov kub siab.

4. Qhov Tseem Ceeb ntawm Kev Tso Pa Tawm Tsawg thiab FFKM Ua Haujlwm Li Cas

Hauv cov chaw muaj cua tshuab ntau, kev tso pa tawm yog qhov ua tsis tiav tseem ceeb uas ua rau cov txheej txheem huv si. Cov hom pa tawm tuaj yeem rov tso rau ntawm cov nplaim wafer, tsim kev puas tsuaj lossis hloov pauv qhov loj me tseem ceeb.

Kev Huv Huv ntawm Cov Khoom Siv: Cov tshuaj FFKM uas yog semiconductor-qib yog tsim los nrog cov ntsiab lus hlau ion qis heev (feem ntau <10 ppm) thiab yog tsim tawm hauv chav huv kom txo cov ntsiab lus organic uas tsis hloov pauv txij thaum pib.

Muaj Peev Xwm Ci Tawm: Ib qho txiaj ntsig tseem ceeb ntawm FFKM yog nws lub peev xwm los tiv taus cov txheej txheem ci tawm hauv qhov kub siab (piv txwv li, 150–200 ° C hauv lub tshuab nqus tsev) ua ntej pib ua cov txheej txheem. Cov kauj ruam no ua rau cov dej noo thiab cov khoom seem uas tsis muaj molecular hnyav tawm, ua tiav qhov poob tag nrho (TML) thiab cov khoom siv uas tsis muaj zog (CVCM) uas xav tau rau cov txheej txheem rhiab heev.

Kev Tiv Thaiv Kev Nkag: Cov qauv ntom ntom, tag nrho cov fluorinated ua haujlwm ua ib qho kev thaiv loj tiv thaiv cov pa roj nkag, tiv thaiv cov pa roj hauv huab cua kom tsis txhob nkag mus rau hauv chav thiab cov txheej txheem cov pa roj kom tsis txhob tawm.

5. Cov Qauv Xaiv Tseem Ceeb Tshaj Li Chav Kawm Khoom Siv

Tsis yog txhua yam khoom sib xyaw FFKM yog tsim los zoo ib yam. Thaum teev cov foob rau kev siv etching, cov engineers yuav tsum xav txog ntau yam tseem ceeb.

Qhov Xaiv Tau Kev Xav Txog Tseem Ceeb Kev Cuam Tshuam Rau Kev Ua Tau Zoo
Qib sib xyaw Cov qib txheem piv rau "Plasma-Optimized" Cov qib uas tau kho kom zoo dua ntawm cov ntshav muab kev tiv thaiv zoo dua rau kev tawm tsam radical thiab txo cov khoom me me.
Kev Nyuaj Siab (Durometer) Feem ntau 75–90 Ntug Dej A Cov ntsaws ruaj ruaj mos dua (75A) ua tau zoo dua rau cov ntsaws ruaj ruaj ruaj; cov ntsaws ruaj ruaj tawv dua (90A) tiv taus kev rho tawm hauv qhov sib txawv siab.
Kev Tsim Qauv Gland Qhov sib piv ntawm kev sib zog, qhov chaw tiav (Ra ≤ 0.4 µm) Ib qho chaw ua haujlwm gland polished txo qhov kev puas tsuaj ntawm lub foob thiab txo cov chaw nucleation rau kev tawm pa tawm.
Kev Pov Thawj & Kev Taug Qab Tau SEMI F57, ISO 14644 Chav Kawm X Xyuas kom meej tias cov khoom ua tau raws li cov qauv particulate thiab purity ntawm cov khoom niaj hnub no.

6. Tej Yam Tsis Zoo Thiab Tej Yam Zoo Tshaj Plaws

Tsis Txhob Extrusion: Hauv cov ntawv thov nrog cov qhov sib txawv siab, kev siv cov khoom siv tiv thaiv extrusion (piv txwv li, PTFE backup rings) raug pom zoo kom tiv thaiv cov elastomer kom tsis txhob raug yuam rau hauv qhov sib txawv, uas tuaj yeem ua rau lub foob tsis ua haujlwm thiab cov khoom me me poob.

Kev Siv thiab Kev Teeb Tsa: Txawm hais tias lawv muaj zog, cov foob FFKM yooj yim raug mob thiab txiav thaum lub sijhawm teeb tsa yog tias siv tsis raug. Kev siv cov cuab yeej teeb tsa tshwj xeeb thiab xyuas kom meej tias cov npoo ntawm lub qog muaj qhov sib npaug (tsis ntse) yog qhov tseem ceeb rau kev khaws cia qhov ruaj khov ntawm lub foob.

Kev Tswj Xyuas Lub Neej: Kev teem sijhawm hloov pauv ua ntej raws li cov sijhawm raug cov ntshav hauv cov ntshav (tsis yog tos kom muaj qhov xau) yog qhov kev coj ua zoo tshaj plaws los zam kev siv cov cuab yeej tsis tau npaj tseg thiab cov wafer seem.

7. Cov Qauv Yav Tom Ntej: Kev Thawb Kom Muaj Kev Huv Si Ntau Dua

Thaum cov semiconductor nodes nce mus txog 2nm thiab dhau ntawd, qhov kev kam rau kev ua qias tuaj ze li xoom. Kev lag luam tab tom txav mus rau "tiam tom ntej" FFKM formulations nrog cov qib qis dua ntawm cov ionic impurities thiab kev faib tawm qhov hnyav molecular kom haum rau kev tswj hwm kev tawm pa tawm hauv qab UV (EUV) lithography thiab atomic layer etch (ALE) tej yam kev mob.

Xaus lus

Kev xaiv lub foob FFKM zoo rau cov txheej txheem etching yog qhov teeb meem ntau yam. Lub hom phiaj tsis yog tsuas yog xaiv cov khoom siv tiv taus tshuaj lom neeg xwb, tab sis xaiv cov khoom sib xyaw thiab tsim uas sib koom ua ke daws cov teeb meem peb yam ntawm kev tawm tsam tshuaj lom neeg, kev ntxhov siab thermal, thiab kev huv ntawm lub tshuab nqus tsev. Los ntawm kev muab cov qib plasma-optimized ua ntej, ua raws li cov cai tsim qauv gland nruj, thiab siv cov txheej txheem ci-tawm nruj, cov chaw tsim khoom siv thiab cov kws ua haujlwm fab tuaj yeem ua tiav qhov kev ua tau zoo xoom-leakage, qis-outgassing xav tau rau kev tsim khoom semiconductor siab.


Cov Ntawv Qhia thiab Cov Qauv Kev Lag Luam:

ASTM D1418 (Txheej Txheem Kev Faib Tawm rau Cov Khoom Siv Roj Hmab)

SEMI F57-0223 (Cov Lus Qhia rau Cov Txheej Txheem Ua Haujlwm, Cov Khoom Siv Semiconductor)

ASTM E595 (Txoj Kev Ntsuas Txheem rau Kev Poob Tag Nrho thiab Cov Khoom Siv Uas Tau Los Ntawm Cov Pa Hluav Taws Xob Los Ntawm Kev Tawm Hauv Ib puag ncig Nqus Tsev)


Lub sijhawm tshaj tawm: Plaub Hlis-10-2026